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华盛顿州立大学Sinisa Mesarovic教授学术报告
发布人:黄永宪  发布时间:2017-11-06   浏览次数:92

华盛顿州立大学Sinisa Mesarovic教授学术报告

应先进焊接与连接国家重点实验室邀请,华盛顿州立大学Sinisa Mesarovic教授于116日面向全校师生做连接过程中的中尺度计算机模拟学术报告,欢迎广大师生参加。

报告人:Sinisa Mesarovic

报告题目:Mesoscale computational models for bonding and joining(连接过程中的中尺度计算机模拟)

报告时间:2017116日(星期一)上午900

报告地点:哈工大材料楼(714报告厅)

报告摘要:

        Physical processes during the joining of metal and ceramic parts are characterized by evolving microstructure (solid phases) and evolving domains (liquid metal in brazing).  Thus, computational modeling of such processes requires that the problem of moving interfaces be addresses within the proper mathematical framework and computationally tractable algorithms.  Standard sharp interface models based on Gibbs surface excess quantities lack the ability to handle topological discontinuities (breakup and coalescence of domains).  In the last two decades, the diffuse interface (phase field) models have emerged as the (arguably) most efficient method for mesoscale simulations of evolving microstructures.