刘威
学位 博士
职称 讲师
电话 +86-0451-86418359
电子邮件 w_liu@hit.edu.cn
主要研究方向
社会兼职
主要学术成果
1、文章及专著(05年以后)：
1）田艳红, 王春青, 刘威:《微连接与纳米连接》机械工业出版社, 2010. 译著.
2）Yanhong Tian,Wei Liu, Rong An, Wei Zhang, Chunqing Wang. Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test Journal of Materials Science: Materials in Electronics. 2012, 23: 136-147.
3）Wei Liu, Rong An, Chunqing Wang, Yanhong Tian, Lei Yang, Lining Sun. Evolution of AuSnx Intermetallic Components in Laser Reflowed Micro-Solder Joints. China Welding. 2011, 20(1):7-11.
4）田艳红, 刘威, 王春青. 构建电子封装技术专业本科生培养体系的研究与实践. 哈尔滨工业大学学报（社科版）2011增刊.
5）(Lei Yang), Wei Liu, Chunqing Wang, Yanhong Tian. Self-Assembly of Three-Dimensional Microstructures in MEMS via Fluxless Laser Reflow Soldering, 2011 12th Proceeding of International Conference on Electronic Packaging and Technology, Shanghai, China. Page(s): 1148-1151.
6）(Lei Yang), Wei Liu, Chunqing Wang, Yanhong Tian. Development of a Three-dimensional Integrated Solder Ball Bumping & Bonding Method for MEMS Devices . 2011 12th Proceeding of International Conference on Electronic Packaging and Technology, Shanghai, China. Page(s): 729-732.
7）安荣, 刘威, 杭春进, 田艳红, 王春青, 安茂忠. 电子封装与组装焊点界面反应及微观组织研究进展. 电子工艺技术. 2011, 32 (6): 322-329
8）Lei Yang, Chunqing Wang, Wei Liu, Yang Li. Study of MEMS Self-Assembly Using Molten Solder Ball. 2010 Proceeding of International Conference on Electronic Packaging and Technology, Beijing, China. Page(s):1302-1307.
9）Wei Liu, Chunqing Wang, Lining Sun, Yanhong Tian. Effect of Protection Atmosphere’s Temperature on Morphology of Au-Sn IMCs in Laser Reflowed Micro-solder Joints. 2010 Proceeding of International Conference on Electronic Packaging and Technology, Beijing, China. Page(s):442-445.
10）Wei Liu, Chunqing Wang, Yanhong Tian. Effect of Cu addition in sn-containing solder joints on interfacial reactions with Au foils. Proceeding of ICEPT-HDP 2009, Beijing, August 11-13,2009. Page(s):642 - 645
11）W. Liu, C.Q. Wang, Y.H. Tian, M.Y. Li. Investigation of sagging phenomenon observed in laser reflow soldering right-angled solder joints during isothermal aging or thermal cycle process. Journal of Alloys and Compounds. 2008, 458:323-329. (SCI, EI index)
12）W. Liu, C.Q. Wang, Y.H. Tian, Y.R. Chen. Effect of Zn addition in Sn rich alloys on interfacial reaction with Au foil. Transactions of Nonferrous Metals Society of China.2008. 18(3): 617-622. (SCI, EI index)
13）W. Liu, C.Q. Wang, Y.H. Tian, L.C. Kong. Sagging Phenomenon Observed in Micro-solder Joints Fabricated by Laser Reflow Soldering Process. Journal of Materials Science and Engineering, USA.2008, 2(4): 37-42.
14）W. Liu, C.Q. Wang, Y.H. Tian, M.Y. Li. Effect of laser input energy on AuSnx intermetallic components formation in solder joints with different thickness of Au surface finish on pads. Acta Metallurgica Sinica. 2008, 21 (3):1-8. (EI index)
15）W. Liu, C.Q. Wang, Y.H. Tian, L.C. Kong. Sagging Phenomenon of Micro-Solder Joints Fabricated by Laser Reflow Process. 8th International Conference on Electronics Packaging Technology (ICEPT). 2007:375-379.
16）W. Liu, C.Q. Wang. Evolution of AuSnx Intermetallic Components in Laser Reflowed Right-angled Solder Joints During Isothermal Aging Process. 7th International Conference on Electronics Packaging Technology (ICEPT). 2006:1-4. (EI index)
17）W. Liu, C.Q. Wang, M.Y. Li, L. Ling, Comparison of AuSnx IMCs’ Morphology, Distribution in Lead-free Solder Joints Fabricated by Laser and Hot Air Reflow Process. 6th International Conference on Electronics Packaging Technology (ICEPT). 2005:423-426. (EI index)
18）W. Liu, C.Q. Wang, M.Y. Li. Effect of Laser Input Energy on Wetting Areas of Solder and Formation of Intermetallic Compound at Sn-0.3Ag-0.75Cu/Au Right-angled Joint Interface. International Conference on Asian Green Electronics (AGEC). 2005:197-201. (EI index)
19）Y.H. Tian, C.Q. Wang, W. Liu. Effects of Cu addition on growth of Au-Sn intermetallic compounds at Sn-xCu/Au interface during aging process. Rare Metals. 2007, 26:331-337. (SCI, EI index)
20）李明雨，关经纬，王春青，刘威. Sn-Ag基无铅钎料Nd：YAG激光重熔界面研究，电子工艺技术. 2006, 27 (5):249-255.
2、专利：
1）刘威, 王春青, 田艳红, 孔令超.. 倒装芯片单金属间化合物微互连结构制备方法 201110105396.2
2）刘威, 王春青, 田艳红, 孔令超.. 单金属间化合物微互连焊点结构 201110105411.3
3）王春青, 刘威, 田艳红, 孔令超. 扫描式薄膜图形激光转移方法 201110103942.9
4）王春青, (杨磊), 刘威, 田艳红. 基于钎料球激光重熔工艺的MEMS自组装方法201110439730.8
5）王春青, (杨磊), 刘威, 田艳红. 一种基于引线键合的MEMS自组装过程的限位方法 201110439586.8
6）孔令超, 田艳红, 王春青, 刘威, 安荣. 采用红外多点测温热阻法检测电路板焊点可靠性的检测系统 201110033879.6 7）孔令超, 田艳红, 王春青, 刘威, 安荣, 杭春进. 检测电路板焊点可靠性的红外测温检测法 201110033883.2
8）王春青, (杨磊), 刘威. 田艳红. 面向MEMS立体封装和组装的锡球凸点键合方法 201010222496.9
9）王春青, (杨磊), 刘威. 田艳红植球键合机的锡球供料装置 201010511370.3