| 序号 | 论文名称 | 作者 | 刊物名称 | 年,卷,期,页 | 检索 |
| 1 | Batch treatment of industrial components using plasma immersion ion implantation and deposition | L.P. Wang,
Y.H. Wang,
Y.H. Yu,
H.X. Liu | Surface & Coatings Technology | 2007, 201: 6585-6588 | SCI |
| 2 | Particle-in-cell simulation of metal plasma flow in dual plasma deposition | L.P. Wang ,
Y.H. Yu,
X.F. Wang,
B.Y. Tang | Surface & Coatings Technology | 2007,201:
6576�6580 | SCI |
| 3 | TiN/ZrO2 multilayers synthesized on GCr15 bearing steel using plasma immersion ion implantation and deposition | Tao Sun,
Langping Wang, Yonghao Yu,
Yuhang Wang,
Xiaofeng Wang | Surface & Coatings Technology | 2007, 201: 6615�6618 | SCI |
| 4 | Fatigue life and mechanical behaviors of bearing steel by nitrogen plasma immersion ion implantation | Hongxi Liu,
Baoyin Tang,
Langping Wang,
Xiaofeng Wang | Surface & Coatings Technology | 2007, 201:
5273-5277 | SCI |
| 5 | Rolling contact fatigue and mechanical properties of titanium carbide film synthesized on bearing steel surface | Hong-xi Liu,
Xiao-feng Wang,
Lang-ping Wang | Surface & Coatings Technology | 2007,201:
6606-6610 | SCI |
| 6 | Microstructures and wear resistance of large WC particles reinforced surface metal matrix composites produced by plasma melt injection | Aiguo liu,
Miamhuan Guo,
Minhai Zhao,
Changbai Wang | Surface & Coating Technology | 2007 ,201:
7978-7982 | SCI |
| 7 | Anode Current Effects in Plasma Electrolytic Oxidation | C. B. Wei,
X. B. Tian,
S. Q. Yang,
X. B. Wang,
R. K. Y. Fu,
P. K. Chu | Surface and Coatings Technology | 2007. 201(9-11):5021-5024 | SCI |
| 8 | Particle-in-Cell Numerical Simulation of Non-Uniform Plasma Immersion Ion Implantation | Y. X. Huang,
X. B. Tian,
S. Q. Yang,
R. K. Y. Fu,
P. K. Chu | Surface and Coatings Technology | 2007. 201(9-11):5458-5462 | SCI |
| 9 | Antibacterial copper-containing titanium nitride films produced by dual magnetron sputtering | Tian, X. B.,
Wang, Z. M.,
Yang, S. Q.,
Luo, Z. J.,
Fu, R. K. Y.,
Chu, P. K. | Surface & Coatings Technology | 2007. 201(19-20):8606-8609 | SCI |
| 10 | Plasma processing of AISI 304 stainless steel using radio frequency hollow cathode discharge | Tian, X. B.,
Jiang, H. F.,
Yang, S. Q.,
Luo, Z. J. | Surface & Coatings Technology | 2007. 201(19-20):8650-8653 | SCI |
| 11 | Plasma distribution in the slender bore excited by coaxial rf electrode | Cui, J. T.,
Tian, X. B.,
Yang, S. Q.,
Hu, T. | Surface & Coatings Technology | 2007. 201(15):6651-6654 | SCI |
| 12 | Three Dimensional Monte Carlo Simulation of Grain Growth in HAZ of Stainless Steel SUS316 | Yanhong Wei,
Yanli Xu,
Zhibo Dong,
Jilin Xiao | Key Engineering Materials | 2007, 353-358:
1923-1926 | EI ISTP |
| 13 | Effects of arc distance on angular distortion by asymmetrical double sided arc welding | Zhang H.J.,
Zhang G.J.,
Wu L. | Science and Technology of Welding and Joining | 2007, 12(6): 564-571 | SCI |
| 14 | Arc-Heating Hot-wire Assisted Arc Welding Technique for Low-Resistance Welding Wire | S.X. Lv,
X. B. Tian,
H.T.Wang,
S. Q. Yang | Science and Technology of Welding and Joining | 2007, 12(5)431-435 | SCI |
| 15 | Novel approach to enhancement of ultrasonic TOFD B-scan image for measurement of weld | Gang Tie,
Chi Dazhao | Science and Technology of Welding and Joining | 2007,12(1):
87-93 | SCI |
| 16 | Vacuum brazing of the C/C composite and Ti-6Al-4V with AgCu braze alloy | Qin Youqiong,
Feng Jicai | Science and Technology of Welding and Joining | 2007, 12(2): 1-4
没有正式发表 | SCI |
| 17 | Numerical simulation of columnar dendritic grain growth during weld solidification process | Y. H. Wei,
X. H. Zhan,
Z. B. Dong,
L. Yu | Science and Technology of Welding and Joining | 2007, 12(2): 138-146 | SCI |
| 18 | Numerical analysis of plasma arc welding process for aluminum alloy. Science and Technology of Welding and Joining | H. X. Wang,
Y. H. Wei,
C. L. Yang | Science and Technology of Welding and Joining | 2007, 12 (1): 32-44 | SCI |
| 19 | Vision Based Measuring System For Both Weld Pool and root gap in continuous current GTAW | J.Q. Gao,
C.S. Wu | Science and Technology of Welding and Joining | 2007, 12 (1): 50-54 | SCI |
| 20 | Temperature, stress and microstructure in 10Ni5CrMoV steel plate during air�arc cutting process | Junfeng Hu,
Jianguo Yang,
Hongyuan Fang,
Guangmin Li,
Yong Zhang | Computational Materials Science | 2007 (38) 631-641 | SCI |
| 21 | Numerical simulation of variable polarity vertical-up plasma arc welding process | H. X. Wang,
Y. H. Wei,
C. L. Yang | Computational Materials Science | 2007,38(4): 571-587 | SCI |
| 22 | Numerical calculation of variable polarity keyhole plasma arc welding process for aluminum alloys based on finite difference method | H. X. Wang,
Y. H. Wei,
C. L. Yang | Computational Materials Science | 2007,40 (2): 213-225 | SCI |
| 23 | Microstructure evolution and reaction mechanism during reactive joining of TiAl intermetallic to TiC cermet using Ti�Al�C�Ni interlayer | J.C. Feng,
J. Cao,
Z.R. Li | Journal of Alloys and Compounds | 2007,436(1-2):298-302 | SCI |
| 24 | Reactive wetting of Sn0.7Cu-xZn lead-free solders on Cu substrate | HongqinWang,
Fengjiang Wang,
Feng Gao,
Xin Ma,
Yiyu Qian | Journal of Alloys and Compounds | 2005,433:302-305 | SCI |
| 25 | Influence of aging treatment on deformation behavior of 96.5Sn3.5Ag lead-free solder alloy during in situ tensile tests | Ding Ying,
Wang Chunqing,
Tian Yanhong,
Li Mingyu | Journal of Alloys and Compounds | 2007, 428,1-2, 274-285 | SCI |
| 26 | Numerical Simulation of the Stress Field of Thick 7B04 Aluminum Alloy Board During Continuous Manufacture Procedure. Solid State Phenomena | Hongyuan Fang, Chenglei Fan | Solid State Phenomena | 2007,127(10):259-264 | SCI |
| 27 | Abel inversion using Legendre wavelets expansion | Shuiliang Ma,
Hongming Gao,
Guangjun Zhang,
Lin Wu | Quant. Spectrosc. Radiat. Transfer | 2007, 107(1): 61�71 | SCI EI |
| 28 | Effect of hydrogen on diffusion bonding of the hydrogenated Ti6Al4V alloy containing 0.3 wt.% hydrogen | J. C. Feng,
H. Liu,
P. He,
J. Cao | International Journal of Hydrogen Energy | 2007,32(14):
3054-3058 | SCI |
| 29 | Effect of reaction heat on reactive joining of TiAl intermetallics using Ti-Al-C interlayers | J. Cao,
C. Feng,
Z. R. Li | Scripta Materialia | 2007,57(5):
421-424 | SCI |
| 30 | Microstructure and mechanical properties of C/C composite/TC4 joint using AgCuTi filler metal | Youqiong Qin，
Jicai Feng | Materials Science and Engineering A | 2007,454-455:322-327 | SCI |
| 31 | Optical and mechanical properties of alumina films fabricated on Kapton polymer by plasma immersion ion implantation and deposition using different biases | Huang Y.X.,
Tian X.B.,
Yang S.Q.,
Fu R.K.Y.,
Chu P.K. | Applied Surface Science | 2007,253(24):9483-9488 | SCI |
| 32 | Effects of bias on surface properties of TiN films fabricated by hollow cathode discharge | Jiang, H. F.,
Tian, X. B.,
Yang, S. Q.,
Fu, R. K. Y. | Journal of Vacuum Science & Technology A | 2007,25(4): 837-842 | SCI |
| 33 | Expulsion in Resistance Spot Welding of AZ31B Magnesium Alloy | Z.D. Zhang,
Y.R. Wang,
D.Q. Li | Materials Science Forum | 2007,546-549: 443-446 | SCI |
| 34 | Comparison of interface evolution of ultrasonic aluminum and gold wire wedge bonds during thermal aging | Hongjun Ji,
Mingyu Li,
Chunqing Wang | Materials Science and Engineering A | 2007,447: 111�118 | SCI |
| 35 | Effects of solder volume on formation and redeposition of Au-containing intermetallics in Au/Ni-SnAgCu-Ni(P) solder joints | H.T. Chen,
C.Q. Wang,
Cheng.Y | Journal of electronic materials | 2007,36(1): 33-39 | SCI |
| 36 | Cross-interaction of interfacial reactions in Ni (AuNiCu)-SnAg-Cu solder joints during reflow soldering and thermal aging | H.T. Chen,
C.Q. Wang,
Cheng.Y | Journal of electronic materials | 2007, 36(1):
26-32 | SCI |
| 37 | Influence of thermal cycling on the microstructure and shear strength of Sn3.5Ag0.75Cu and Sn63Pb37 solder joints on Au/Ni metallization | H.T. Chen,
C.Q. Wang,
M.Y. Li | Journal of Materials Science and Technology | 2007, 23(1): 68-72 | SCI |