田艳红、李明雨、刘威、陈宏涛于2009年8月参加在北京举办的“电子封装国际会议”，并作《Modeling thermal fatigue in anisotropic Sn-Ag-Cu/Cu solder joints》、《Characterization of Ag Nanofilm Metallization on Copper Chip Interconnect and its Ultrasonic Bondability》、《Dramatic Morphological Change of Interfacial Prism-type Cu6Sn5 in the Sn3.5Ag/Cu Joints Reflowed by Induction Heating》、《Effect of Cu addition in sn-containing solder joints on interfacial reactions with Au foils》。