王春青，田艳红于2010年8月参加在西安举办的“Proceeding of International Conference on Electronic Packaging and Technology”会议，并作《Study of MEMS Self-Assembly Using Molten Solder Ball》，《Ultrasonic Bondability and Antioxidation Property of Ti/Cu/Ag Metallization on Si Substrate》，《Finite Element Analysis of Electromigration Reliability in Copper Chip Interconnect》报告。