田艳红
工学博士
教授；博士生导师
+86-451-86418359
主要研究方向
微纳连接基础：纳米连接；微互连界面微观结构，力学行为，尺寸效应，可靠性，电迁移失效机理
微系统封装及三维封装：3D封装；TSV通孔互连；芯片键合
微纳器件封装：纳米器件制备、表征及界面行为。
社会兼职
国际电子封装学会(IMAPS)《Journal of Microelectronics and Electronic Packaging-JMEP》杂志副主编；
中国电子学会电子封装技术专委会 理事；
2013年教育部新世纪人才。
主要学术成果
在国际国内学术期刊上发表论文100余篇，其中SCI论文59余篇。他引总和174，发表学术论文多次获奖。获黑龙江省高校科学技术一等奖，黑龙江省教育厅高等教育教学成果二等奖。申请发明专利19项，已获得授权8项。
1、Yanhong Tian, Chunqing Wang. 英文著作：《Microjoining and Nanojoining》第12章《Laser Soldering》,英国Woodhead出版社，2008. pp: 299-326。
2、田艳红，王春青，刘威. 译著《微连接与纳米连接》，机械工业出版社，2010年出版。
3、Yanhong Tian, Chunjin Hang, Chunqing Wang. Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing. Materials Science and Engineering A529 (2011) 468�478. IF:2.104
4、Yanhong Tian, Chunjin Hang, Chunqing Wang. Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound. Microelectronics Reliability, 2011(1):157-165. SCI, IF:1.152
5、Yanhong Tian, Wei Liu, Chunqing Wang. Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test. Journal of Materials Science: Materials in Electronics,2011. SCI，IF:1.097
6、Yanhong Tian, Chunqing Wang. Investigation of ultrasonic copper wire wedge bonding on Au/Ni plated Cu substrates at ambient temperature. Journal of materials processing technology. 2008,208(1-3), pp 179-186. SCI, IF:1.143
7、Yanhong Tian, Chunqing Wang. Finite element modeling of electron beam welding of a large complex Al alloy structure by parallel computations. Journal of materials processing technology. 2008(199):p41-48. SCI,IF: 1.143
8、Yanhong Tian, Chunqing Wang. Characteristics of Laser Reflow Bumping of Sn3.5Ag and Sn3.5Ag0.5Cu Lead-Free Solder Balls. J. Mater. Sci. Technol. 2008,24(2) :p220-226. SCI, IF:0.828
9、Dewen Tian, Yanhong Tian, Chunqing Wang. Three-Dimensional Modelling of Solder Droplet Impact onto A Groove Journal of Physics D: Applied Physics. 2008 (41): 245-257 SCI,IF:2.104
10、Dewen Tian, Yanhong Tian, Chunqing Wang. Modeling of an oblique impact of solder droplet onto a groove with the impact point to be offset from the groove surfaces interface Journal of Materials Science2009,44(7), pp 1772-1779 SCI,IF:1.471